Mi Material revenue jumps 15.6% on chip packaging demand

Revenue surged to $117m from $83.4m YoY.

Mi Material Holding Limited reported a gross profit of $54m (US$42.6m) in the first nine months (9M), driven by sustained demand for its solder spheres in semiconductor packaging.

The group recently debuted on the Singapore Exchange (SGX) Mainboard through a $215m semiconductor offering.

Gross profit margin for the third quarter (Q3) stood at 47.6%, broadly stable from 48% in the second quarter (Q2). For 9M2026, gross profit margin improved to 46.6%, from 45.8% in the first half of the year.

The group attributed the improvement to a shift towards higher-margin proprietary alloys, alongside higher sales volumes and selling prices. Its adjusted profit after tax margin also rose to 28.1% in 9M2026, from 26.6% in the first half.

Revenue reached US$37.8m in Q3, up 15.6% from US$32.7m in Q2, driven primarily by higher sales volumes and sustained customer demand for its patented alloy solder spheres.

Mi Material said demand across the high-performance computing (HPC), memory, mobility and wearables segments is expected to support its performance for the remainder of the financial year.

The group expects positive revenue momentum to continue in the fourth quarter, traditionally its strongest quarter, supported by demand for advanced semiconductor packaging materials.

“As we enter what is traditionally our strongest quarter, we are optimistic about the opportunities ahead,” said Kevin Tan, CEO of Mi Material.

He said the group is well-positioned to expand manufacturing capacity, advance research and development initiatives, and create long-term value for shareholders.

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