STATS ChipPAC unveils eWLB packaging design

Package height reduced by 70%.

According to OSK, STATS ChipPAC, the world’s 4th largest semiconductor back-end testing and packaging service provider (around 7% market share) unveiled a new cutting edge packaging design that use its ultra-thin embedded Wafer Level Ball (eWLB) Grid Array technology.

Here's more:

The breakthrough managed to make its hot-in-demand eWLB design even more attractive with the package height shrinking further down by 70% (1mm to 0.3mm). According to the management, the new design will be an excellent choice for IC vendors to adopt in delivering high performance but cost-effective solution to the ultraslim electronic devices market.

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