Micron breaks ground on $31b wafer fab

The facility is expected to create 1,600 jobs with wafer production slated to begin in the second half of 2028.

Micron Technology, Inc. broke ground on a $31b wafer fabrication facility located within its existing NAND manufacturing complex in Singapore on 27 January.

The facility is designed to ultimately provide 700,000 square feet of cleanroom space, according to the company's press release. Wafer output is expected to commence in the second half of 2028.

In addition, the facility will provide capacity to support continued technology transitions, whilst deepening research partnerships between industry and academia.

It is expected to create 1,600 jobs, which, together with the previously announced 1,400, brings the total to around 3,000 new Micron jobs.

The positions will focus on fab engineering and operations, integrating AI, advanced robotics and smart manufacturing technologies to enhance efficiency and innovation, the press release said.

The fab will comply with the company’s sustainability commitments and build on the site’s recognition whilst adhering to LEED standards, such as greenhouse gas abatement, water recycling and waste circularity.

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